发明名称 HEAT SUNK, LASER MODULE, LASER DEVICE, AND LASER-PROCESSING DEVICE
摘要 <p>A pair of opening portions are provided as an inlet port of refrigerant and an outlet port thereof, and refrigerant flow channels are formed left-right symmetrically in its plan view from one opening portion to the other opening portion. At the area adjusted to the area which is thermally connected to the heating element in the refrigerant flow channels, projections whose cross section thereof become smaller and smaller upward from the bottom surface of the refrigerant flow channels or downward from the upper surface, that is, widens toward the end, are formed. By joining the heat radiating plate having the projections formed therein to the other heat radiating plate, which is plate-shaped, together, a heat sink is assembled. Therefore, the heat sinks are excellent in terms of thermal conductivity and reliability, are produced at a low cost, and a laser module employing the same, a laser module apparatus, and a laser processing apparatus are obtainable.</p>
申请公布号 EP1605220(B1) 申请公布日期 2009.11.11
申请号 EP20040712166 申请日期 2004.02.18
申请人 LASERFRONT TECHNOLOGIES, INC. 发明人 KOUTA, HIKARU;TAKAHASHI, HISAYA;MIKUBO, KAZUYUKI;ONO, HIDEYUKI;TUNEKANE, MASAKI;ISHIDA, TOSHINORI;KUBOTA, KEIICHI
分类号 F28D15/02;H01L23/46;H01L23/473;H01S3/094;H01S5/024 主分类号 F28D15/02
代理机构 代理人
主权项
地址