发明名称 Structure and method for fabricating self-aligned metal contacts
摘要 A semiconductor structure including at least one transistor is provided which has a stressed channel region that is a result of having a stressed layer present atop a gate conductor that includes a stack comprising a bottom polysilicon (polySi) layer and a top metal semiconductor alloy (i.e., metal silicide) layer. The stressed layer is self-aligned to the gate conductor. The inventive structure also has a reduced external parasitic S/D resistance as a result of having a metallic contact located atop source/drain regions that include a surface region comprised of a metal semiconductor alloy. The metallic contact is self-aligned to the gate conductor.
申请公布号 US7615831(B2) 申请公布日期 2009.11.10
申请号 US20070925168 申请日期 2007.10.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ZHU HUILONG;RAUSCH WERNER
分类号 H01L31/119 主分类号 H01L31/119
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