SOLIDE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A solid imaging device and a manufacturing method thereof are provided to manufacture a plurality of solid imaging devices by bonding a transparent on a surface of a substrate with an optical sensor. CONSTITUTION: A transparent plate(6) is fixed in the surface of a semiconductor substrate to face the plane to an optical sensor. A through hole(26) is formed in the semiconductor substrate. A first insulation layer(28) covers an inner surface of the through hole of the semiconductor substrate. A second insulation layer(30) surrounds the opening of the through hole of the semiconductor substrate. A conductive material is electrically connected to a lower side of a bonding pad. A flexible circuit board(8) is fixed in the same rear side to face the plane to the rear side of the semiconductor substrate.