发明名称 |
Metal duplex method |
摘要 |
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
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申请公布号 |
US7615255(B2) |
申请公布日期 |
2009.11.10 |
申请号 |
US20060511155 |
申请日期 |
2006.08.28 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
LAU DANNY;KWOK RAYMUND W. M. |
分类号 |
C25D5/50;B05D3/02;B32B15/01;H01L23/532 |
主分类号 |
C25D5/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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