发明名称 |
Flex circuit constructions for high capacity circuit module systems and methods |
摘要 |
Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.
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申请公布号 |
US7616452(B2) |
申请公布日期 |
2009.11.10 |
申请号 |
US20060331969 |
申请日期 |
2006.01.13 |
申请人 |
ENTORIAN TECHNOLOGIES, LP |
发明人 |
WEHRLY, JR. JAMES DOUGLAS;GOODWIN PAUL;RAPPORT RUSSELL |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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