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发明名称
METHOD OF FABRICATING SOLDER BUMP FOR FLIP CHIP TECHNOLOGY
摘要
申请公布号
KR100925666(B1)
申请公布日期
2009.11.10
申请号
KR20070132993
申请日期
2007.12.18
申请人
发明人
分类号
H01L23/488
主分类号
H01L23/488
代理机构
代理人
主权项
地址
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