| 摘要 |
A device for processing the contact surface of a mold profile has a table for receiving the mold profile and a heating wire running in accordance with the cross-sectional profile of the contact surface to be produced, which is movable in relation to the table along the contact surface. The mold profile is rotatable around the receptacle axis coaxially to the table receiving the contact surface in relation to the heating wire, which, originating from the receptacle axis, runs diagonally in relation to the receptacle axis at an angle corresponding to the conical contact surface to be processed, and the table has a passage for the heating wire to be inserted into the processing allowance of the mold profile in relation to the table in the direction of the receptacle axis.
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