| 摘要 |
PURPOSE: A flexible printed circuit board and a manufacturing method thereof are provided to prevent a bending phenomenon of a product by maintaining levelness of a polyimide and an inorganic layer. CONSTITUTION: A manufacturing method of a flexible printed circuit board includes the following steps of: forming a circuit board on a Flexible Copper Clad Laminate having a copper plated layer(S1); manufacturing the flexible printed circuit board by attaching a cover layer; producing an adhesive layer, a polyimide layer, and an inorganic layer on the flexible printed circuit board; laminating the adhesive layer, the polyimide layer, and inorganic layer temporarily(S2); forming a label layer with a label attaching method; attaching a protective film on the top of the label layer; proceeding the surface of the flexible printed circuit board(S3); and completing the flexible printed circuit board after removing the protective film(S4).
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