An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
申请公布号
US7615842(B2)
申请公布日期
2009.11.10
申请号
US20060473079
申请日期
2006.06.23
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE JOO-HO;PARK HAE-SEOK;HA BYEOUNG-JU;HONG SEOG-WOO;CHOI HYUNG;SONG IN-SANG