System in package (SIP) integrated circuit and packaging method thereof

摘要

The present invention discloses a system in package (SIP) integrated circuit and a packaging method thereof. The SIP integrated circuit includes one or more first block dices produced by a first process and one or more second block dices produced by a second process. The first block dices are electrically connected to the second block dices. The first block dices and the second block dices are packaged into a system.