发明名称 Enhanced heat pipe cooling with MHD fluid flow
摘要 A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat. In a method for cooling a heat sink connected to a plurality of heat pipes and containing a plurality of MHD fluid pipes, the method includes generating a plurality of magnetic fields using an array of magnets; creating an electric potential from a top surface to a bottom surface of each MHD fluid pipe using a plurality of metal films; and inducing electrically-conductive MHD fluid to circulate in the plurality of MHD fluid pipes by the plurality of magnetic fields and the electric potential.
申请公布号 US7614445(B2) 申请公布日期 2009.11.10
申请号 US20060345762 申请日期 2006.02.02
申请人 发明人 OUYANG CHIEN
分类号 F28F27/00;F28D15/00 主分类号 F28F27/00
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