| 摘要 |
The present application relates to a method of bonding dissimilar metals (1,2), a bonding structure formed by such a method and a bonding apparatus for performing such a method. The resulting bond is capable of preventing corrosion (e.g., electric corrosion) resulting from contact of the dissimilar metals (1,2) and obtains a dissimilar material joint exhibiting anti-corrosive property and bonding strength at low costs. The method includes overlapping two materials (1,2) made from dissimilar metals having a seal material (3) interposed therebetween and discharging the seal material (3) from a bonding interface and bonding the two materials (1,2) in direct contact with each other. |
