| 摘要 |
PURPOSE: A connection device of lead frame for a semiconductor device is provided to remove a defect in interconnecting lead frames by welding accurate portion to be welded. CONSTITUTION: In a connection device of lead frame for a semiconductor device, a cutting jig settling portion is equipped on a main body(110). A cutting unit(120) cuts the one end of the lead frame supplied from the outside, and a welding unit(130) mutually welds the end parts of the lead frames which is cut by the cutting unit. The lead frame is depressed on the center of the cutting jig(122). A guide bar(124) is extended by a certain height while being fixed at both sides of the cutting jig settling portion. A first cylinder(125) is operated by an external power source. |
