| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin which can be microprocessed since the resin has photosensitivity, which is developable with a diluted alkali aqueous solution, curable at a low temperature (200°C or lower), high in flexibility, and excellent in electric insulation reliability, solder heat resistance and organic solvent resistance, and which has small warpage of a substrate after being cured, and has excellent adhesion with a sealing agent. <P>SOLUTION: The photosensitive resin composition contains, at least: (A) an imide oligomer having a hydroxyl group at the molecular end; (B) a diol compound; (C) (Ca) a compound having at least one block isocyanate group and at least one photosensitive group in the molecule and/or (Cb) a compound having at least one photosensitive group and at least one hydroxyl group in the molecule; (D) a block isocyanate compound; (E) a photosensitive compound; (F) a photopolymerization initiator; and (G) a thermosetting compound. <P>COPYRIGHT: (C)2010,JPO&INPIT |
