发明名称 SUBSTRATE OVERLAYING DEVICE, SUBSTRATE HOLDING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate overlaying device that is easy to manufacture and handle, and precisely overlays substrates. <P>SOLUTION: The substrate overlaying device includes: a first substrate holding unit which holds a first substrate having a first index for positioning on an upper surface on a first substrate holding surface, and has a light transparent part at a position where at least the first index is observed from the opposite surface side of the first substrate holding surface; a second substrate holding unit which holds a second substrate having a second index for positioning on an upper surface on a second substrate holding surface; an index observation unit for optically observing at least the first index through the light transparent part with observation light from the opposite direction of the first substrate holding surface; and a position adjusting unit which adjusts relative positions of the first substrate and second substrate according to the position of the first index observed by the index observation unit. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009260007(A) 申请公布日期 2009.11.05
申请号 JP20080106716 申请日期 2008.04.16
申请人 NIKON CORP 发明人 MAEDA HIDEHIRO
分类号 H01L21/02;H01L27/00 主分类号 H01L21/02
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