| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of simply and inexpensively manufacturing a double-sided electrode package of a structure having excellent connection reliability and humidity-resistant reliability with another package compared with a case where a conventional resin sealing method such as a transfer mold method is used. <P>SOLUTION: In the double-sided electrode package 10, a sealing resin layer 50 is formed so as to fill peripheries of surface-side terminals 36 formed on a package substrate 12. Since the side surfaces of the surface-side terminals 36 have plural protruded rims, adhesion with the sealing resin layer 50 is improved by an anchor effect. At a sealing step, since supplied liquid resin is naturally flowed to form the sealing resin layer 50, a "mold step" and a "grinding step" may be omitted, and thus the sealing step may be simplified more greatly than a case where the resin sealing is carried out by a transfer method. <P>COPYRIGHT: (C)2010,JPO&INPIT |
