THERMOSETTING RESIN, ITS MANUFACTURING METHOD, THERMOSETTING COMPOSITION CONTAINING THERMOSET RESIN, ITS MOLDED ARTICLE, CURED MATERIAL CURED MOLDED MATERIAL AND ELECTRONIC EQUIPMENT CONTAINING THEM

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin superior in heat resistivity, good in electric characteristics, remarkably improved in brittleness, capable of controlling the characteristics in a wide range and to provide a method of manufacturing it. SOLUTION: The thermosetting resin has a structure shown by general formula (I) in which [n is an integer of 2 to 200]. COPYRIGHT: (C)2010,JPO&INPIT