METHOD FOR MANUFACTURING OF INSULATING SHEET, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide methods for manufacturing of an insulating sheet which includes a low rate of moisture absorption and superb electrical properties including a low dielectric constant and low dielectric loss, and in which the fibers can readily be impregnated with the resin, a copper clad laminate and a printed circuit board, and to provide the printed circuit board using the same.

SOLUTION: The method of manufacturing the insulating sheet by the invention includes processes of: forming a thermoplastic reinforcement material which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer.

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