ELECTROPLATING SUBSTRATE CONTAINING METAL CATALYST LAYER AND METAL SEED LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD USING THE SAME

摘要

Disclosed are an electroplating substrate containing a metal catalyst layer and a metal seed layer, and a method for producing a printed circuit board using the same. The electroplating substrate comprises a rigid substrate, a metal catalyst layer, and a metal seed layer. The rigid substrate includes a surface treatment layer containing a reactive functional group. The metal catalyst layer is continuously or discontinuously formed on the surface treatment layer of the rigid substrate through a dry deposition process. Through the dry deposition process, the metal seed layer is formed on the front surface of the rigid substrate on which the metal catalyst layer is formed. The metal catalyst layer is activated by a heating process. Various factors such as hydrogen and moisture are removed by both the heating process and the metal catalyst layer activated by the heating process, wherein the hydrogen and moisture are formed on an electroplated film during an electroplating process for producing a printed circuit board and affect the degradation of adhesion between the metal seed layer and the rigid substrate. Accordingly, the invention can reduce the time required for restoring the adhesion between the metal seed layer and the rigid substrate degraded after electroplating, and can increase the adhesion between the metal seed layer and the rigid substrate.