| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce an area necessary for a sensor element. <P>SOLUTION: Outside of each cavity (17), a contact line (16) is arranged on a substrate wafer and the contact line electrically connects a sensor element, and between a pair of sensor elements (2) adjacent to each other on the substrate wafer (1), just one contact hole (9) is provided in a cap wafer (3) and the contact line approaches the sensor element through the contact hole (9), and between another pair of sensor elements adjacent to each other on the substrate wafer, just one connection tape is arranged and the one connection tape mutually separates the cavity in which the another pair of sensor elements is arranged. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
