| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer flexible printed wiring board capable of mounting a small-pitch and high-density CSP thereon. <P>SOLUTION: This multilayer flexible printed wiring board includes: mounting pads 34 for mounting a chip-sized package thereon in a first conductive layer 7 of the first layer from an outer layer side of a build-up layer; a ground layer immediately under a region for mounting at least the chip-sized package in a second conductive layer 2 of the second layer from the outer layer side of the build-up layer; a wiring pattern for wiring a signal circuit electrically connected through a skip via hole 28 skipping the ground layer of the second conductive layer from the mounting pads in a third conductive layer 3 of the third layer from the outer layer side of the build-up layer; and a flexible cable part in which bottoms of blind via holes contacts the back faces of the mounting pads of the first conductive layer, and which is integrated with the build-up layer having via holes connecting the build-up layer to a core board separately from the skip via hole. Its manufacturing method is also provided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
