| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inexpensive thermocompression bonding apparatus having a simple structure, in which thermal deformation such as warpage of circuit elements does not occur on a circuit board through electroconductive adhesives composed of thermosetting resins, and sure mounting with electrical conductive connection is performed. <P>SOLUTION: In the thermocompression bonding apparatus, there are formed a concave pressing face 21a of the press head 21 of a thermocompression bonding tool 20 on a curved concave face, and a supporting face 12a of the compression support member 12 of a stage 10 on a curved convex face. A liquid panel work W on which a semiconductor chip 6 is mounted at a predetermined position of the substrate extending portion 3a of a liquid display element 1 with an anisotropic electroconductive adhesive 7 is set on the thermocompression bonding apparatus. The surface of the semiconductor chip 6 is heat pressed with the pressing face 21a whose temperature is raised with a heater 23 embedded in the body 22 of the thermocompression bonding tool 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
