MANUFACTURING METHOD FOR PACKAGE SUBSTRATE WITH FINE CIRCUIT PATTERN BY ANODIC OXIDATION

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package substrate with a fine circuit pattern by anodic oxidation by which a finer circuit can be provided by using an existing facility, and further a package substrate possible to prevent an interface peel-off phenomenon from occurring between layers can be provided. SOLUTION: A method of manufacturing a package substrate comprising steps of: forming open areas on a surface of a metal core through a masking process; growing oxidation layers through the open areas by anodizing the metal core; forming a fine circuit pattern by forming conductive layers between the oxidation layers; forming a resin layer on the surface of the metal core with the fine circuit pattern; and selectively etching the other surface of the metal core. COPYRIGHT: (C)2010,JPO&INPIT