发明名称 SPUTTERING TARGET, AND SPUTTERING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering target capable of improving variance of the sheet resistance by reducing variance of the composition ratio of a film to be deposited during the film deposition on a substrate by a carousel type sputtering apparatus using the sputtering target consisting of a composite material, and a sputtering method. Ž<P>SOLUTION: The sputtering target 203 is used in a carousel type sputtering apparatus 10, and has first to third rectangular target components 203a-203c divided into three sections in the longitudinal direction. The first to third target components contains a first material (Ta) and a second material (SiC). The composition ratios of the first and second materials in the first and third target components are different from the composition ratios of the first and second materials in the second target component. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009256721(A) 申请公布日期 2009.11.05
申请号 JP20080106602 申请日期 2008.04.16
申请人 TDK CORP 发明人 MOCHIZUKI KAZUO;IINO TADASHI
分类号 C23C14/34;C23C14/06 主分类号 C23C14/34
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