METHOD AND SYSTEM FOR MONITORING A PREDICTED PRODUCT QUALITY DISTRIBUTION

摘要

In a complex manufacturing environment for producing semiconductor devices, a predicted quality distribution in the form of a graded die forecast may be monitored with respect to changes in order to more efficiently identify factory disturbances. To this end, a predicted distribution obtained on the basis of electrical measurement data may be compared with a predicted yield distribution based on other production data. That is, an efficient automatic monitoring of the manufacturing environment may be accomplished with reduced probability of missing respective disturbance situations, since the large number of electrical parameters may be condensed into the predicted quality distribution.