WIRING BOARD, PROCESS FOR PRODUCING THE SAME, AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE

摘要

A wiring board comprising a base, a Cu wiring pattern provided on the base, a first metal layer provided on the surface of the Cu wiring pattern and a second metal layer provided on the surface of the first metal layer. The first metal layer is lower in the reactivity with Cu than the second metal layer, and the first metal layer and the second metal layer induce a eutectic reaction.