| 摘要 |
[PROBLEMS] To provide a multilayer printed wiring board the connection reliability of which does not degraded because a small-diameter via hole is used. [MEANS FOR SOLVING PROBLEMS] A via hole (60A) is formed on a cap plated layer (36a). Most part of the bottom portion is formed in an area other than the area where a through hole (36) is formed. The stress in the vial hole (60A) in a heat cycle is greater than that in a via hole formed in a second interlayer resin insulating layer (150). For the reason, the bottom diameter of the via hole (60A) is made larger than that of the via hole (160). |
