SUB-MOUNT, LIGHT-EMITTING DIODE PACKAGE, AND MANUFACTURING METHOD OF THE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a sub-mount which has a high heat radiating effect and can save a manufacturing cost, and to provide a light-emitting diode package and a manufacturing method of the sub-mount.

SOLUTION: A sub-mount includes a plurality of metal bodies with a plurality of light-emitting diodes, respectively attached thereto and an oxidized wall interposed between the adjacent metal bodies so that the adjacent metal bodies are supported by each other and are electrically separated from one another, and its metal bodies are oxidized selectively to form the sub-mount.

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