| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the packaging density of a semiconductor device, in which a semiconductor construction body is embedded, in an insulator constituted of a lower layer insulating film, an insulating layer, and an upper layer insulating film. <P>SOLUTION: A first semiconductor construction body 2a is mounted at the upper face center of a lower layer insulating film 1 by a facedown method. A second semiconductor constructing body 2b is mounted on the first semiconductor constructing body 2a by a face up method. An insulating layer 32 is formed on the upper face of the lower layer insulating film 1 around the first and second semiconductor constructing bodies 2a and 2b. An upper layer insulating film 33 is formed on the second semiconductor constructing body 2b and the insulating layer 32. Here, since the first and second semiconductor construction bodies 2a and 2b are laminated and embedded into an insulator, constituted of the lower layer insulatingfilm 1, the insulatinglayer 32, and the upper layer insulatingfilm 33, the package density can be made larger than when one semiconductor constructing body is embedded. <P>COPYRIGHT: (C)2010,JPO&INPIT |
