| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic chip device suitable to be crumpled or folded together without deteriorating a film substrate and an interface. <P>SOLUTION: The electronic chip device includes: a film interface substrate having a film substrate 1 and at least one plane conductive interface 2 arranged on the film substrate 1; and a microcircuit 4 connected to the interface 2. The film interface substrate has characteristics suitable to be crumpled or folded together without deteriorating the interface 2. A compensating film 22 suitable to be crumpled or folded is arranged on the film substrate 1. The compensating film 22 comprises a recess 23 containing the microcircuit 4, its connections 7, 8 and a coating material 13. <P>COPYRIGHT: (C)2010,JPO&INPIT |
