FILM-LIKE ADHESIVE FOR SEALING SEMICONDUCTOR, AND SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a film-like adhesive for sealing a semiconductor that is fully superb in working efficiency when used for sealing a semiconductor apparatus, and can manufacture a semiconductor apparatus fully superb in connection reliability by fully suppressing the occurrence of a void following high-temperature heating. SOLUTION: The film-like adhesive for sealing a semiconductor contains an epoxy resin (a) and a phenol resin (b). When melt viscosity by heating at a temperature of 350°C for 0.5 seconds is set to V1(Pa s) and that by heating at a temperature of 350°C for one second is set to V2(Pa s), V1 and V2 satisfy a formula 1: V2/V1≥1.5 and a formula 2:V1≤700. COPYRIGHT: (C)2010,JPO&INPIT