发明名称 |
METHOD FOR MANUFACTURING SOI SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an SOI (Silicon On Insulator) substrate in which crystal defects of a single crystal semiconductor layer are reduced. SOLUTION: An oxide film containing halogen is formed on each of surfaces of a single crystal semiconductor substrate and of a semiconductor substrate provided with a single crystal semiconductor layer separated from the single crystal semiconductor substrate, whereby impurities that exist on the surfaces of and inside the substrates are decreased. In addition, the single crystal semiconductor layer provided over the semiconductor substrate is irradiated with a laser beam, whereby crystallinity of the single crystal semiconductor layer is improved and planarity is improved. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009260315(A) |
申请公布日期 |
2009.11.05 |
申请号 |
JP20090069955 |
申请日期 |
2009.03.23 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;NISHIDA ERIKO;SHIMAZU TAKASHI |
分类号 |
H01L21/02;H01L21/20;H01L21/265;H01L21/268;H01L21/322;H01L21/336;H01L21/8234;H01L21/8238;H01L27/06;H01L27/08;H01L27/092;H01L27/12;H01L29/786;H01L51/50 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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