Transponder i.e. radio frequency identification transponder, for use in e.g. electronic passport, has substrate for carrying functional structures, where functional structures are arranged in receptacles of substrate

摘要

The transponder (1) has a substrate (4) for carrying a number of functional structures (3) such as strip conductor structures and/or semiconductor components. The functional structures are arranged in receptacles (5) of the substrate, where one of the receptacles is provided at an upper side (6) or a lower side (7) of the substrate, and the functional structures do not project over a surface (15) of the transponder. Each receptacle is designed as a surface cavity according to the type of a furrow or trench. Independent claims are also included for the following: (1) a method for manufacturing a transponder (2) a method for manufacturing a multi-layered device.