| 摘要 |
<p>The present invention is directed toward methods and systems for cooling electronics. More particularly, in various embodiments, the present invention provides systems and methods for cooling a data storage device. In some embodiments, a multiple data storage device enclosure might include a first data storage device and a second data storage device. Both data storage devices may be within the multiple data storage device enclosure. In various embodiments, a first cooling device, external to the first and second data storage device may be coupled to the multiple data storage device enclosure. Additionally, in some embodiments, a controller, may be coupled to the cooling device and configured to receive control signals from the first and second data storage devices.</p> |
