| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the number of pins in a semiconductor device, and to reduce cost. <P>SOLUTION: The semiconductor device comprises a microcomputer chip 3, an SDRAM 2 which is horizontally disposed by the side of the microcomputer chip 3 and the thickness of which is thinner than that of the microcomputer chip 3, a tab 5c, a plurality of inner leads 5a and outer leads 5b, a first wire 6a for connecting the pad of the microcomputer chip 3 to the pad of the SDRAM 2, and a second wire 6b which is disposed to jump over the SDRAM 2 while connecting the pad of the microcomputer chip 3 to the inner lead 5a, and the loop of which is formed at a location higher than the loop of the first wire 6a. The interface circuit of a bus for memory is closed in a package by using only interconnection between chips without connecting it to external terminals, and pins for connection of the external terminals can be thereby utilized for other functions. Accordingly, the number of pins can be increased, and the cost of SIP (semiconductor device) 1 can be reduced by adopting a frame type. <P>COPYRIGHT: (C)2010,JPO&INPIT |
