| 摘要 |
PROBLEM TO BE SOLVED: To solve such problems that, though a high temperature solder alloy used for the inside of an electronic component contains Pb as the main component, the Pb-containing high temperature solder alloy has a question in lead pollution, thus a lead-free high temperature solder alloy is required, and further that the conventional lead-free high temperature solder alloy has a question in heat resistance, brittleness or a solidification range between a solidus temperature and a liquidus temperature. SOLUTION: By the solder composition in which the composition of a soldering part is composed of, by weight, 10 to 40% Sb and 0.5 to 10% Cu, and the balance Sn, the question in heat resistance, brittleness or a solidification range between a solidus temperature and a liquidus temperature can be solved. Further, for the purpose of improving mechanical strength, one or more elements selected from Co, Fe, Mo, Cr, Ag and Bi are added, and, as an oxidization-suppressing element(s), one or more selected from Ge and Ga are added. COPYRIGHT: (C)2010,JPO&INPIT
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