DEVICE WITH ENCAPSULATED INTEGRATED CIRCUIT AND A N/MEMS AND METHOD FOR PRODUCTION

摘要

The invention relates to a method for production of a device (100), comprising at least one integrated circuit (104) and at least one N/MEMS (122), comprising at least the following steps: production of the N/MEMS in at least one upper layer (116) arranged at least above a first section of a substrate (120), production of the integrated circuit in a second section of the substrate and/or in a semiconductor layer arranged at least above the second section of the substrate and further comprising the production of a cover (124) encapsulating the N/MEMS from at least one layer used for the production of a grid (114) in the integrated circuit and/or for the production of at least one electrical contact(128, 130, 132, 134) of the integrated circuit.