An object of the present invention is to provide a metal frame for electronic components which minimizes the occurrence of defects such as short circuit caused by whiskers. To accomplish this object, the present invention provides a metal frame for electronic components comprising a lead part connected electrically to an electronic device, wherein the said lead part includes a first metal layer which comprises copper (Cu) as a main ingredient and further comprises boron (B) or beryllium (Be).
申请公布号
WO2009134012(A2)
申请公布日期
2009.11.05
申请号
WO2009KR01551
申请日期
2009.03.26
申请人
ILJIN COPPER FOIL CO., LTD.;LEE, DONG NYUNG;KIM, SANG BEOM;KANG, KYOO SIK;IM, SU CHUL
发明人
LEE, DONG NYUNG;KIM, SANG BEOM;KANG, KYOO SIK;IM, SU CHUL