发明名称 METAL FRAME FOR ELECTRONIC COMPONENTS
摘要 An object of the present invention is to provide a metal frame for electronic components which minimizes the occurrence of defects such as short circuit caused by whiskers. To accomplish this object, the present invention provides a metal frame for electronic components comprising a lead part connected electrically to an electronic device, wherein the said lead part includes a first metal layer which comprises copper (Cu) as a main ingredient and further comprises boron (B) or beryllium (Be).
申请公布号 WO2009134012(A2) 申请公布日期 2009.11.05
申请号 WO2009KR01551 申请日期 2009.03.26
申请人 ILJIN COPPER FOIL CO., LTD.;LEE, DONG NYUNG;KIM, SANG BEOM;KANG, KYOO SIK;IM, SU CHUL 发明人 LEE, DONG NYUNG;KIM, SANG BEOM;KANG, KYOO SIK;IM, SU CHUL
分类号 H01L23/495 主分类号 H01L23/495
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