| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a solder-resist layer, which is excellent in coloring power and hiding power and has high aspect ratio and high resolution. <P>SOLUTION: The photosensitive resin composition contains a perylene type colorant and a carboxylic acid-containing resin. Further, the photosensitive resin composition may contain a phthalocyanine base colorant, of which the color tone is green or orange. The photosensitive resin composition imparts high resolution, with respect to an alkali-developing photo-solder resist, in particular, the solder resist for a printed wiring board. <P>COPYRIGHT: (C)2010,JPO&INPIT |
