发明名称 ANISOTROPIC CONDUCTIVE FILM, JOINTED BODY, AND METHOD FOR MANUFACTURING OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provided an anisotropic conductive film capable of obtaining a high conduction reliability by improving an adhesive strength to a circuit member and provide a jointed body and a method for manufacturing of the same. <P>SOLUTION: The anisotropic conductive film is for connecting a first circuit member electrically with a second circuit member in which a membrane containing nitrogen atoms is formed on a surface facing the first circuit member, and is provided with a first layer arranged on a side of the first circuit member and a second layer arranged on a side of the second circuit member. The first layer contains a cationic hardening agent and a first thermoset resin, and the second layer contains a radial hardening agent and a second thermoset resin, and at least either of the first or the second layer contains conductive particles, and a difference between maximum exothermic peak temperatures of the first and the second layers is 20&deg;C or less. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009259787(A) 申请公布日期 2009.11.05
申请号 JP20090055308 申请日期 2009.03.09
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 ISHIMATSU TOMOYUKI
分类号 H01R11/01;H01B5/16;H01R43/00 主分类号 H01R11/01
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