发明名称 CONNECTION STRUCTURE FOR CIRCUIT BOARD AND CONNECTOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a structure of connection part for circuit board and connector which has waterproofness, strength, dustproofness, and fire retardancy without distortions or deterioration of components due to heating of molding. <P>SOLUTION: An inner mold 11 which is a reactant hot melt of urethane system, capable of low-temperature molding and having a high mechanical strength is molded on the connection part of a circuit board and an electronic component and an over-mold 12 which is a fire-retardant polyamide, based hot melt is molded so as to cover the inner molding 11. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009259615(A) 申请公布日期 2009.11.05
申请号 JP20080107624 申请日期 2008.04.17
申请人 FUJIKURA LTD 发明人 OSAKI TAKUYA;ISHITANI YUJI
分类号 H01R4/70 主分类号 H01R4/70
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