| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper precursor composition that is useful in forming wiring for use in electronics or the like and thermally decomposes at a low temperature, and a method of preparing a copper film using the copper precursor composition. Ž<P>SOLUTION: The copper precursor composition comprising a compound represented by formula (1) (in the formula, X represents formula (2); R<SP>1</SP>, R<SP>2</SP>each independently represent a 1-6C alkyl group that may contain a substituent; and R<SP>3</SP>represents a 4-10C divalent group) and copper formate, thermally decomposes at a low temperature. A copper film can be prepared at a low temperature by using the copper precursor composition. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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