HOUSING FOR HIGH-POWER LEDS

摘要

The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base part (1) and a head part (5) which are connected by means of a glass layer (2). One section of the top side of the base part defines a mounting region (12) for an optoelectronic functional element (60) and is additionally a heat sink for the optoelectronic functional element. The head part extends, at least in sections, over the periphery of the mounting region and forms, above the mounting region, a passage region (52, 61) for the radiation emitted by the optoelectronic functional element or the radiation to be received. When assembling the base part, the glass layer and the head part, the glass layer is heated to such an extent that the glass reaches a viscosity at which the glass adheres, and the base part and the head part form a composite assembly by means of the first glass layer. Glass makes it possible to produce a hermetic encapsulation with increased thermal stability.