发明名称 METHOD FOR CUTTING PHOTOELECTRIC COMPOSITE WIRE FILM AND DICING TAPE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for cutting a photoelectric composite wire film, which improves waveguide position accuracy of an optical waveguide film by using a core of an optical waveguide as a positioning reference for outer shape machining, and a dicing tape for cutting the film. <P>SOLUTION: A metal foil 4, the dicing tape 2 and the photoelectric composite wire film 1 including a flexible printed wiring board 9 and an optical waveguide film 10 laminated one over another are successively disposed on a work table 5, and cut by a dicing blade 8 while reflecting illuminating light to the metal foil 4. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009258692(A) 申请公布日期 2009.11.05
申请号 JP20090066033 申请日期 2009.03.18
申请人 HITACHI CHEM CO LTD 发明人 YAGI SHIGEYUKI;KURODA TOSHIHIRO
分类号 G02B6/13 主分类号 G02B6/13
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