| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide underfill equipment which can correspond to all the steps of a series of underfill methods (a dam forming step, a dug portion forming step, and an underfill filling step) and which can securely produce a printed-wiring board, and provide underfill equipment and an underfill method using the same which can improve the working efficiency and ease of step-to-step connection in consideration of maintenance nature. Ž<P>SOLUTION: Underfill equipment includes a dam material dispenser 6 for supplying a dam material for forming a dam for controlling the effusion of an underfill material on the periphery of an electronic component 3, an ultraviolet ray laser irradiation device 5 for performing irradiation with ultraviolet laser for curing the dam material or the underfill material, a plurality of support axes 7 for holding an underfill material dispenser 4, the dam material dispenser 6, and the ultraviolet laser irradiation device 5, a mechanism around which the support axes 7 turn, and structural materials 8 and 8a which are connected with the mechanism around which the support axes 7 turn. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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