| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat conductive silicone composition used as an adhesive for a solid adherend, a heat conductive silicone adhesion structure obtained by adhering the cured product of the above composition to the solid adherend, and a semiconductor device fabricated by employing the above structure. <P>SOLUTION: The heat conductive silicone composition is an adhesive for a solid adherend, at least the surface of which is made of a noble metal. The composition includes (A) an organopolysiloxane having at least one alkenyl group bonded to a silicon atom in a single molecule, (B) an organohydrogenpolysiloxane having 5 to 30 hydrogen atoms bonded to silicon atoms in a single molecule, (C) a heat conductive filler having thermal conductivity of not less than 10 W/m°C, and (D) a catalyst selected from a group consisting of platinum and platinum compounds; and the composition has a viscosity of 10 to 1,000 Pa s at 25°C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
