| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat exchange capable of improving product quality by positively joining dimples, and capable of realizing even cost reduction by suppressing defective products. <P>SOLUTION: Outflow holes 32 are bored in flat apexes 31 of mutually opposing dimples 30, uneven structures for securing gaps spreading solder material from an inner circumference rim of the outflow holes 32 to the apexes 31 of the dimples 30 are formed in peripheries of the outflow holes 32, and a plurality of recessed grooves 33 or the like are formed, radially extending from the inner circumference rims of the outflow holes 32. <P>COPYRIGHT: (C)2010,JPO&INPIT |
