发明名称 LASER MACHINING APPARATUS AND LASER MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus and a laser machining method, capable of excellently forming point-marks machined with laser beams of immediately after the start of machining. <P>SOLUTION: The laser machining apparatus machines the surface of a workpiece 10 loaded on a table 21 from the start point of laser machining by irradiating the surface of the workpiece 10 with a laser beam while rotating the table 21. While a laser beam for non-machining is emitted from a laser source 31 for machining, an offset signal generating circuit 62 generates an offset signal of a level corresponding to a change from the focal distance of an objective lens 35 in the incidence of a laser beam for non-machining to the focal distance of the objective lens 35 in the incidence of a laser beam for machining, and offsets the focal position of the laser beam. Thus, when the emission of the laser beam for non-machining is switched to the emission of the laser beam for machining, the offset signal generation from the offset signal generating circuit 62 is stopped, and the laser beam is focused on the surface of the workpiece 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009255150(A) 申请公布日期 2009.11.05
申请号 JP20080109729 申请日期 2008.04.21
申请人 PULSTEC INDUSTRIAL CO LTD 发明人 IKETANI HIROBUMI
分类号 B23K26/04;B23K26/00;H01S3/00 主分类号 B23K26/04
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