| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component module capable of manufacturing an electronic component module in a structure where a passive element and an active element are built into the same base wiring layer by a simple manufacturing process. <P>SOLUTION: When manufacturing the electronic component module 15 in a configuration where a CR component 9 as a passive element and an IC chip 8 as an active element have been fitted to the same base wiring layer 1, an adhesive layer 5A containing a solder particle 7 is formed on a circuit formation surface 2a of the base wiring layer 1, the CR component 9 is mounted first and then the IC chip 8 is mounted on the base wiring layer 1 and is adhered to the base wiring layer 1 by an adhesive layer 5A, then a thermosetting sheet 12 for forming a sealed resin layer is bonded to the circuit formation surface 2a of the base wiring layer 1 where the CR component 9 and the IC chip 8 are adhered, thermo compression bonding is performed, and the curing of the adhesive layer 5A and the melting of a solder particle 7 contained in the adhesive layer 5A are performed simultaneously. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
