| 摘要 |
PROBLEM TO BE SOLVED: To suppress action of stress generated in joining an element to a bump to the element, to suppress variations of quality of an electronic part, and to raise a manufacturing yield in the electronic part in which the element is loaded on a substrate via the bump. SOLUTION: The electronic part includes a substrate 11 having a first planar surface, a first bump 14 fixed to the first planar surface of the substrate 11, a second bump 18 fixed to the first planar surface of the substrate 11 and arranged around the first bump 14, the element 12 fixed to the first bump 14 and the second bump 18 at a position in non-contact and opposite to the first planar surface of the substrate 11, and an adhesive region contacting with the first bump 14, the substrate 11 and the element 12. COPYRIGHT: (C)2010,JPO&INPIT |
